我们的网站为什么显示成这样?

可能因为您的浏览器不支持样式,您可以更新您的浏览器到最新版本,以获取对此功能的支持,访问下面的网站,获取关于浏览器的信息:

|本期目录/Table of Contents|

职业紧张及相关因素对电子器件制造工职业倦怠的影响分析(PDF)

《现代预防医学》[ISSN:1003-8507/CN:51-1365/R]

期数:
2018年12期
页码:
2133-2136
栏目:
环境与职业卫生
出版日期:
2018-06-30

文章信息/Info

Title:
Effects of occupational stress and related factors on job burnout status of workers in chip manufacturing industry
作者:
杨雪莹1王亭2曾强1李培1
1. 天津市疾病预防控制中心,天津 300000;
2. 天津市滨海新区疾病预防控制中心,天津 300000
Author(s):
YANG Xue-ying* WANG Ting ZENG Qiang LI Pei
*Tianjin Center of Disease Control and Prevention, Tianjin 300000, China
关键词:
电子器件制造业职业倦怠职业紧张影响因素
Keywords:
Chip manufacturing industry Job burnout Occupational stress Influencing factor
分类号:
R135
DOI:
-
文献标识码:
A
摘要:
目的 对电子器件制造工职业倦怠患病现况及职业紧张相关因素对其的影响进行分析。方法 采用整群抽样的方法,以某电子器件制造企业2 251名作业人员为调查对象,分别采用职业倦怠通用量表(MBI - GS)、简明工作要求 - 自主(JDC)问卷和付出 - 回报失衡(ERI)问卷对电子器件制造员工职业倦怠和职业紧张相关因素进行测评。结果 2 251例调查对象轻度职业倦怠1 013例,高度职业倦怠162例,职业倦怠检出率为52.2%(1175/2251)。单因素分析显示,JDC职业紧张和ERI职业紧张组相关变量对职业倦怠检出率均高于相应对照组,差异均有统计学意义(P<0.05)。多因素Logistic回归分析结果显示:单身、ERI职业紧张、内在投入评分高、ERI比值高为电子器件制造工职业倦怠的危险因素。非流水线岗位、工作要求得分高、自主程度评分高、社会支持评分高、D/C比值高、内在投入评分高为电子器件制造工职业倦怠的保护因素。结论 电子器件制造工中职业倦怠检出率偏高,ERI职业紧张模式在职业倦怠预报中更有效。企业应特别重视单身、流水线岗位、ERI职业紧张、内在投入得分高、ERI比值高的员工职业倦怠的发生。
Abstract:
Objective To investigate the prevalence of occupational stress on job burnout on workers in chip manufacturing industry. Methods A total of 2 251 workers in chip manufacturing industry were selected as study subjects by using cluster sampling method. Job burnout were measured by Maslach Burn-out Inventory general questionnaire(MBI-GS). The simple Occupational Stress Questionnaire and The Chinese version of Effort-reword imbalance questionnaire(ERI)Questionnaire were used to investigate and evaluate their job demand-control-support questionnaire (JDC) and ERI Occupational stress situation respectively. Results Among the 2 251 workers, 52.2%(1 175/2 251) were found high level of job burnout.162 workers were the highest-level job burnout.1 013 workers were the higher-level job burnout. There were significant different between related groups of JDC and ERI occupational stress (P<0.05) by univariate analysis. The multivariate logistic analysis results indicated the protective factors of job burnout including single, ERI occupational stress, hing over-commitment、high ERI ratio. While the risk factors of job burnout including non-assembly line post, high requirement for work, high degree of autonomy, high social support score, high D/C ratio and high inward investment. Conclusion The rate of job burnout of workers is relatively high in chip manufacturing factory. ERI occupational stress model is more effective in job burnout prediction. Enterprises should pay special attention to the occurrence of job burnout among single workers, assembly who are line posts, ERI occupational, hing over-commitment stress or high ERI ratio.

参考文献/References

-

备注/Memo

备注/Memo:
作者简介: 杨雪莹(1977 - ),女,硕士,主管医师, 研究方向:职业病预防和控制
通讯作者:曾强, E-mail:tjcdczys@126.com
更新日期/Last Update: 2018-06-27